A heat pipe is a simple device that depending on the application can quickly transfer heat from one point to another or it can be used to spread heat, to isothermalize an uneven temperature distribution.
Heat pipes are often referred to as the “superconductors” of heat as they possess an extra ordinary heat transfer capacity and rate with almost no heat loss.
Columbia-Staver heat pipes have many advantages and applications when used as part of a thermal solution. Integrating heat pipes into a system can solve problems in systems that might have limited space at the power source to fit a heat sink, may have a weight restriction, high density power application or limited airflow. There are many ways to integrate heat pipes, but most applications fall into two main categories.
One of the fundamental properties of a heat pipe is the unique heat transfer capability that allows them to transport heat to a point remote from the heat generator, often to a location better suited to deal with the thermal dissipation.
One end of the heat pipe is attached to the heat source often through a metal plate called the evaporator. The other end is in a cooler area and often has fins attached to the heat pipe, the condenser. Evaporator/condenser heat pipe assemblies can be used to transport heat from a high-power component located in a constrained area with no room for a more traditional heat sink solution, to a region where fin array can be placed. Fins can be designed for both natural and forced convection. The heat pipes are malleable enough to be formed into complex geometry in order to avoid potential obstacles.
A heat sink operates by spreading the heat from the heat source/sources through its base and into the fins for dissipation. The efficiency of the Heat sink is constrained by the spreading resistance in the base material. By embedding heat pipes into the base of a heat sink, the spreading capability of the base, and therefore the overall heat sink performance can be greatly improved. This means that a heat sink can often be reduced in size or the system can be upgraded to a higher power.
A vapour chamber is a planar 2-phase device that works in a similar way to a heat pipe. The most common vapour chambers are square or rectangular, but they could be manufactured in almost any shape. In the most basic configuration, the vapour chamber consists of a copper sealed container. As in a heat pipe a wick structure is formed on the inside wall of the container and a small amount of working fluid commonly water is added (to soak the wick), a vacuum is pulled and the container sealed.
The low pressure existing inside the chamber (created by pulling the vacuum) allows the working fluid to evaporate at a temperature much lower than its normal boiling point.
When heat is applied to the vapour chamber, the working fluid in the wick structure near that location evaporates and rushes to fill the entire volume of the chamber (driven by pressure difference). When the vapour comes into contact with a cooler surface, it condenses, and gives up its latent heat of vaporization. The condensed fluid is returned to the heat source by the capillary action of the wick structure. As the vaporization and condensation cycle repeats, heat is moved from the heat source to the entire volume of the chamber, resulting in a uniform temperature distribution on its surface.
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